Equipment

The Laser Center is equipped with a wide range of advanced laser processing equipment, covering a diverse spectrum of wavelengths and pulse durations. These systems enable the execution of a broad variety of processes on different materials, providing highly specialized solutions tailored to the specific needs of each application. Additionally, the center boasts an extensive array of characterization equipment, essential for the detailed analysis and evaluation of the results obtained. Below is a detailed list of the available equipment, along with their most relevant features.

Laser Microprocessing Laboratory

  • UV ns Laser Micro-machining Station ML-100
    • Spectra Physics HIPPO DPSS Nd:YVO4 355 nm (pulse width ~15 ns, 15-300 kHz, 5 W @ 50 kHz, processing head with fixed lens and processing gas)
    • Excimer ATL Laser Lasertechnik SP300i KrF excimer 248 nm (pulse width ~7 ns, 300 Hz, 5W @ 300 Hz, Mask Projection)
    • Linear, rotary, and inclined XYZ platform, TTL vision system
  • UV ns/ps (quasi-CW) Laser Micro-machining Station AB200
    • Spectra Physics Pulseo DPSS Nd:YVO4 (1Hz-400 kHz, 20 W @100 kHz, pulse width <20 ns)
    • Spectra Physics Vanguard DPSS Nd:YVO4 (80 MHz, 2.5 W, pulse width <10 ps)
    • 6 DOF positioning system, TTL vision system, head with fixed lens, scanner, linear, rotary, and inclined XYZ platform
  • INNOLAS ps Laser Micro-machining Station
    • Lumera Superrapid. DPSS Nd:YVO4 1064 nm / 532 nm / 355 nm, pulse width ~8 ps, 18W @1064 nm, 8W @ 532 nm, 4W @ 355 nm
    • XYZ platform (430x555x127mm), head with fixed lens and process gas, scanner (for all wavelengths), vision system for sample alignment.
  • FS Laser Micro and Nano Fabrication Station EKSPLA FemtoLux30
    • EKSPLA FemtoLux30 30W, wavelength 1030 nm, maximum pulse energy > 80 uJ, variable pulse width 350 fs ~1 ps, possibility of pulse train (burst) with variable repetition rate from single pulse to 1 MHz and 250 uJ
    • XYZ platform, head with fixed lens, scanner, vision system for sample alignment.

Appolo Hub Lab

Two test benches for laser systems manufactured by Mondragón Assembly for the UPM Laser Center within the FP7 Appolo project. These benches allow the assembly of all kinds of positioning, vision, and control systems for laser processes.

  • Test Bench 1:
    • EKSPLA Atlantic laser ps (60 W) with IR, VIS, and UV emission.
    • Optical system with scanner and fixed lens for all wavelengths.
    • High-speed XY axes (2 m/s)
    • Variable focal optical system TagLens
  • Test Bench 2:
    • Spectra Physics Explorer DPSS Nd:YVO4 532 nm, pulse duration 15 ns, 2 W @ 50 kHz, 20-150 kHz, Energy attenuator, beam shaper (piShaper) for 532 nm
    • Spectra Physics Millennia DPSS Nd:YVO4 532 nm CW – 5 W
    • Spectra Physics Navigator X15SC, 1064 nm, pulse duration 20 ns, 7W@20kHz, 15-100kHz
    • High-speed XY axes (2 m/s), scanner

Laser Shock Wave Processing Laboratory

  • Spectra Physics Quanta Ray Pro 350 High energy Nd:YAG, 10 Hz, 2.5 J per pulse @ 1064 nm, 1.1 J per pulse @ 532 nm, 0.6 J per pulse @ 355 nm
  • ABB industrial robot
  • System for confined irradiation in water
  • Bruker FT-VIS/IR Spectrophotometer

Laser Marking Laboratory

  • Raycus RLF-50QB, Ytterbium fiber laser, wavelength 1060~1085 nm, pulse duration < 120 ns, 50W, 50-100 kHz
  • Scanner, motorized z-axis for focus adjustment

Laser Surface Treatment, Cutting, and Welding Laboratory

  • Raycus Fiber Laser
  • Rofin Dilas DL027S diode laser, wavelengths 808 & 940 nm, CW 2700W, coupled to optical fiber, cylindrical focusing optics
  • DirectPhotonics DirectBond 800 diode laser, wavelength 808 nm, CW, 60W, coupled to fiber
  • Cutting and welding heads
  • ABB industrial robot IRB 4400
  • Powder feeder and cladding head
  • Wire feeder
  • Hybrid welding head
  • Rotary axis
  • Heated bed (up to 750°C)

Laser Bio-printing Laboratory

  • BA-LIFT system from the startup Innofluence
    • Crylas FTSS355-Q4 Nd:YAG laser, 355 nm, pulse duration < 1.3 ns, 1-1000 Hz, 42 mW @ 1 kHz
    • 5-axis positioning system for independent positioning of pain (3 axes, 2 for positioning and 1 for focus adjustment) and acceptor (2 axes)
    • 2 cameras (conventional image and fluorescence)
    • Attenuator
    • System for cellular identification and single-cell transfer
  • Nuaire NU543600E biological safety cabinet
  • Thermo Scientific Sorvall ST8 centrifuge
  • Thermo Scientific MIDI 40 incubator
  • Fisherbrand FSGPD05 hot water bath
  • Zeiss Axiobserver inverted fluorescence microscope

Mechanical Characterization Laboratory

  • Pin-on-disk and reciprocating tribometer tests (Microtest)
  • Residual stress measurement system via blind hole
  • MTS 810 universal servo-hydraulic testing machine
  • Corrosion testing system

Microscopy Laboratory

  • Confocal and Interferometric Microscopy. 3D image acquisition of sample morphology.
    • Leica DCM 3D Confocal Objectives: 10X, 20X, 50X, 100X, Interferometric Objectives: 50X Mirau
  • Scanning Electron Microscopy (SEM) Provides microstructural, morphological, and chemical composition information at the microscopic scale. Equipped with X-ray energy dispersive spectroscopy (EDX) module.
    • Hitachi S-3000 N SEM (Secondary electron module, X-ray dispersion spectroscopy module), Magnification x15-300K, EDX: Working distance 15 mm, TOA: 350d
    • Cathodic sputtering for SEM

Characterization Laboratory for Photovoltaic Applications

  • Raman Spectroscopy. Study and characterization of microstructured materials. Provides compositional information at the molecular level.
    • Renishaw inVía Raman Microscope (Ar ion laser (514.5 nm), Objectives: 5X, 20X, 50X, 100X, XY resolution: 1µm)
  • Electrical characterization system
    • 300-watt Xenon arc lamp, for simulating solar radiation
    • Keithley Model 2400 source meter
    • Dark box for Current-Voltage measurements in the dark.
    • Calibrated solar cell for measurements

Simulation and Modeling Laboratory

Commercial software (Matlab, Abaqus, ANSYS, Comsol, Helios, …) and software developed by researchers at the Laser Center, along with workstations for local execution and access to the Magerit-3 supercomputer from CeSViMa (Supercomputing and Visualization Center of Madrid) at UPM for high-performance computing.

Characterization Laboratory for LIFT Processes

  • Viscosity measurement
    • Viscometer for low and medium viscosities (Brookfield DV2T)
    • Viscometer for high viscosities (Wells/Brookfield HBDV-II Cone spindle CPE- 52)
  • Thickness measurement
    • Optical contact measurement system
    • Interferometric system for fluid thickness (Precitec Interferometric System)
  • Optical system for measuring surface tension (also measures contact angle)
    • Illumination source with diffuser, CCD camera, software
  • Fluid deposition systems (inks/pastes)
    • Automatic applicator (Control Coater model 101 RK PrintCoat Instruments Ltd)
    • Spin Coater (Laurent Technologies model WS-650)

High-Speed Imaging Service

  • High-speed camera (Photron Fastcam Nova) and LED lighting system
  • Blue CW 25 W laser for illumination
  • High-resolution temporal photography system (25 ns)
    • Flash illumination source (Nanolite flash lamp of 25 ns), CCD, optics for the lighting system