A new article has just appeared in J. Chem. Phys.:
M.K. Sing, J. Ramirez and B.D. Olsen, “Mechanical response of transient telechelic networks with many-part stickers”, J. Chem. Phys. 147, 194902 (2017)
In the paper, we study the effect of several individual weak bonds on the mechanical properties of telechelic gel-forming polymers.
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