
On November 18 2025, within the framework of the UPM Conecta event, the partners from the Polytechnic University of Madrid presented the EESF project, the achievements and the work ongoing.

UPM Conecta is an event designed to connect people, ideas and centres, encouraging creativity and collaboration throughout the academic community. From 17 to 21 November of 2025, workshops, talks and activities were held that highlighted the innovation and social commitment of the UPM.
In this context, the EESF UPM team showed the EESF project, the goals, the project partners and the work packages (WPs). The Work Package 2 and The Work Package 3 were described in more detail.
Work pakage 2 consisted on the research activities, which lead to develop a competency framework which alligns skills, attitudes, aptitudes and knowledge for future engineers to integrate sustainability into their professional practice. Another output of Work Package were a discovery and a reseach reports, both available in the eesf project website.

The UPM team lead the Work Package 3, focused on the development of Open Educational Resources (OERs). In the session, the structure and content of the OERs were shown. This is made up of four modules which allows to achieve three levels of development of a ser of specified competences (Basic, Intermediate and Integration). The supporting materials for these OERs consisted on Infographics, text and ad hoc videos. One of these videos was shown.
These resources are currently available in English, Spanish and French on the project’s website (https://eesfproject.eu/ )

Currently, these OERs are under evaluation, through a pilot test campaign which involves students and teachers from the project partner´s countries. The resulting feedback will give a first stage an important feedback to validate the teaching and learning materials.
This meant a successful dissemination of the EESF project, having the attendance of teachers and students who were aware of the high potential of the developed materials in this project.